Wafer-Layer Packaging

Wafer-Layer Packaging

Problem Statement

The terminology of Wafer-Level Packaging is continuously increasing with the passing time. This technology has been very supportive for different aspects. Thus, the use of Wafer-Level Packaging is actually replacing the traditional processes of assembling and packaging the integrated circuits.

Previous Researches

The Wafer-Level Packaging is a new technology which has introduced since last few years. Different authors have made their significant contributions on the topic of Wafer-Level Packaging. The previous researches have described the Wafer-Level Packaging is the technology which is very effective for packaging an integrated circuit at wafer level. This technology has become the replacement of the traditional processes which are used for the purpose of packages assembling of each individual unit after the use of wafer dicing. The technology of WLP is actually a very effective chip-scale packaging technology (CSP), as it provides the resulting package of the same size which is resulted when it dies. The researches also diagnose that wafer-level packaging is an important aspect for finding the ways of truly integrating the water fab, test, burn-in and packaging at the level of water. It is helpful in the complete streamline of the process of manufacturing which is done with the help of a device from silicon start to customer shipment. The Water-Level packaging is mainly used for the purpose of providing extensions to the water feb processes for the purpose of incorporating a device interconnection and is also helpful in the process of device protection. However, it does not include any single industry standard method in the present era.

According to one of the articles presented in www.future-fab.com, the Wafer Level Packaging technology can be categorized into four major parts these days which should be mainly based on the TechSearch and Prismark International. The two important technologies are the Redistribution Layer and Bump Technology which are the most effectively and commonly used technologies in Wafer-Layer Packaging. These technologies are helpful in proper extension of the conventional water fab process by incorporating an extra step which is used for depositing the multi-layer thin-film metal rerouting and establishing an interconnection system for the purpose of connecting each device on the wafers (Yue, 1997). The same standard photolithography can be used for the purpose of achieving it and the different techniques like the thin film deposition can also be used for the purpose of employing it in the device fabrication. This additional level of interconnection is also helpful in the redistribution of the peripheral bonding pads which can be used in each clip. These are interconnected with the chips of an area array which can be used for underbumping the metal pads which can be smoothly used on the surface of the chips. The different bumps can be used for replacing the UBM pads including the solder balls or bumps. These devices can be helpful in making proper connection with the application circuit board over the UBM pads. Along with the provision of Wafer-Level Manufacturing as a very important means of external connection, the redistribution ...